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| IC Lead Measuring Device
LI-300 |
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| IC Lead Measuring Device LI-300 |
| Device to measure automatically one tray, compatible with all types. |
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| Applicable packages |
QFP, SOP, PLCC, SOJ, BGA and CSP
6 x 6 to 40 x 40mm |
| Conveyor |
Tray |
| Processing capacity |
QFP 208Pin : 50sec. approx.
SOP 32Pin : 30sec. approx. |
| External dimension |
1420 x 1250 x 1450 |
| Items to measure |
Flatness and Bend of Lead, Standoff,
Overall height, Overall length, Overall width, Package warp, etc. |
| Option |
Measuring the waved geometry of packages,
Measuring SVP packages |
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