Solar cells, Electronics, and Semiconductors

Solar cells

Application to solar cell wafer processing

Figure: Application to solar cell wafer processing

Construction of solar wafers process line

We were the first in the industry to establish a fixed abrasive processing method using diamond wires for solar cell silicon wafer slicing. This method enables high-speed thinning with a minimum kerf loss and provide higher quality and higher cost performance than conventional loose abrasive methods.

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Photo: Wire saw

Wire saw


Photo: Inspection and measuring devices

Inspection and measuring devices