Machine tools business

Wire saw machines

Photo: Wire saw machines

Yasunaga’s wire saws can make highly-accurate and thin slices from large volumes of brittle and hard materials. Our machines can be used in various fields, such as next generation semiconductor wafers, chemical compounds, sintered materials, and crystals. As a pioneer of wire saws, Yasunaga pursues the possibilities of slicing and leading its evolution.

Large size/Multiple wire type

 

HW810

Photo: HW810

Highly-accurate, high-speed slicing of hard materials up to 8 inches with ultra-high wire speed

This diamond wire saw has the industry’s fastest wire speed of 3,000 m/min, which significantly reduces processing time, warpage, and wire usage. It also supports 8-inch down-cutting, contributing to lower CoO.

  • Target workpieces: SiC, GaN, Sintered materials

SW830D

Photo: SW830D

Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut

Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets

SW2230D

Photo: SW2230D

Wire saw capable of high-tension slicing with high wire speed for hard materials up to 8 inches

Diamond wire saw capable of high-accuracy slicing with narrow center distance, supporting workpieces up to 8 inches.
Highly-accurate and high-speed slicing is made possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, high wire speeds, and main roller oscillation.

  • Target workpieces: SiC, GaN, Sintered materials, Sapphire

Medium size/Multiple wire type

 

SW630D

Photo: SW630D

Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach

6 inch down-cut machine with the minimum wire slack made possible by using the industry's narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials

SW1730D

Photo: SW1730D

Wire saw that can perform high-tension machining of hard materials up to 6 inches with high linear speed

This diamond wire saw is capable of highly-accurate slicing with a narrow main roller pitch for workpieces up to 6 inches.
Highly-accurate high-speed slicing is possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, as well as high wire speeds and main roller oscillation.

  • Target workpieces: SiC, GaN, Sintered materials, Sapphire

SW3020

Photo: SW3020

Wire saw for highly-accurate slicing required in high precision crystal materials

This wire saw precisely cuts brittle materials.
Higher precision slicing is made possible by improved main roller and coolant temperature control.

  • Target workpieces: Crystal, LT/LN, Sintered materials

Compact/Multiple wire type

 

HW1215

Photo: HW1215

Highly-accurate high-speed machining with high workability and high wire speed

This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.

  • Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors

SW1215

Photo: SW1215

Compact wire saw with easy change-over, suitable for high-mix low-volume production

This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.

  • Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets

UD150

Photo: UD150

Compact wire saw capable of highly accurate dicing with high workability

This wire saw is super compact with high workabitlity, which makes it suitable for dicing and wide pitch slicing.
Designed to be compact but rigid, it allows for high wire speed and high tension for highly accurate slicing.

  • Target workpieces: Crystal, pipe materials, Rare-earth materials

Single wire type

 

DW160S

Photo: DW160S

Easy-to-use compact single wire saw

This fixed abrasive single wire saw is ideal for segmented and sample cutting of various types of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
It is compact and easy to operate. (Maximum workpiece size: 8 inches)

  • Target workpieces: Silicon, Quartz, Fluorite, Tungsten carbide

DW340S

Photo: DW340S

Single wire saw capable of cutting long workpieces

This fixed abrasive single wire saw is ideal for segmented and sample machining of a variety of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
An optional goniometer stage and Y-axis table for back and forth functions are available.
(Maximum workpiece size: 13 inches)

  • Target workpieces: Silicon, quartz, fluorite, tungsten carbide

Recycler

 

SSR120

Photo: SSR120

Abrasive recycling system that significantly reduces running costs

This slurry recycler collects abrasives from used slurry, helping to reduce slurry costs and environmental burden.
Its excellent abrasive collection efficiency from waste slurry significantly reduces running costs, while the compact body saves space.

  • Target workpieces: Silicon, Crystal, etc.

HSR500

Photo: HSR500

Abrasive and oil recycling that significantly reduces running costs

In addition to collecting abrasives from used slurry for recycling, this hybrid recycler also removes sludge from separated used oils and collects the oils for recycling. This helps reduce slurry costs and environmental burden.
Its excellent efficiency at collecting abrasives and oil from waste slurry significantly reduces running costs.

  • Target workpieces: Silicon, etc.

OSR2000

Photo: OSR2000

Oil recycling that significantly reduces running costs

This recycler removes sludge from used diamond wire coolant so that the coolant can be recycled. This helps reduce coolant costs and environmental burden.
It excels in stabilizing the concentration of sludge in coolant, significantly reducing running costs, while the compact body saves space.

  • Target workpieces: Silicon, etc.

Test cutting

We offer test cutting for workpieces provided by customers.
Yasunaga proposes solutions using the technical expertise we have cultivated as a wire saw manufacturer.
Test cutting allows us to make more in-depth technical proposals for various materials, including those that are difficult to cut.
We are also flexible regarding peripheral equipment for wire saws, such as automatic workpiece attachment/detachment machines.

Dicing, 2 inches

 

UD150

Photo: UD150

Compact wire saw capable of highly accurate dicing with high workability

This wire saw is super compact with high workabitlity, which makes it suitable for dicing and wide pitch slicing.
Designed to be compact but rigid, it allows for high wire speed and high tension for highly accurate slicing.

  • Target workpieces: Crystal, pipe materials, Rare-earth materials

4 inches

 

HW1215

Photo: HW1215

Highly-accurate high-speed machining with high workability and high wire speed

This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.

  • Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors

SW1215

Photo: SW1215

Compact wire saw with easy change-over, suitable for high-mix low-volume production

This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.

  • Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets

SW3020

Photo: SW3020

Wire saw for highly-accurate slicing required in high precision crystal materials

This wire saw precisely cuts brittle materials.
Higher precision slicing is made possible by improved main roller and coolant temperature control.

  • Target workpieces: Crystal, LT/LN, Sintered materials

6 inches

 

SW630D

Photo: SW630D

Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach

6 inch down-cut machine with the minimum wire slack made possible by using the industry's narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials

SW1730D

Photo: SW1730D

Wire saw that can perform high-tension machining of hard materials up to 6 inches with high linear speed

This diamond wire saw is capable of highly-accurate slicing with a narrow main roller pitch for workpieces up to 6 inches.
Highly-accurate high-speed slicing is possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, as well as high wire speeds and main roller oscillation.

  • Target workpieces: SiC, GaN, Sintered materials, Sapphire

8 inches

 

HW810

Photo: HW810

Highly-accurate, high-speed slicing of hard materials up to 8 inches with ultra-high wire speed

This diamond wire saw has the industry’s fastest wire speed of 3,000 m/min, which significantly reduces processing time, warpage, and wire usage. It also supports 8-inch down-cutting, contributing to lower CoO.

  • Target workpieces: SiC, GaN, Sintered materials

SW2230D

Photo: SW2230D

Wire saw capable of high-tension slicing with high wire speed for hard materials up to 8 inches

Diamond wire saw capable of high-accuracy slicing with narrow center distance, supporting workpieces up to 8 inches.
Highly-accurate and high-speed slicing is made possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, high wire speeds, and main roller oscillation.

  • Target workpieces: SiC, GaN, Sintered materials, Sapphire

SW830D

Photo: SW830D

Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut

Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets

Single wire (8 to 12 inches)

 

DW160S

Photo: DW160S

Easy-to-use compact single wire saw

This fixed abrasive single wire saw is ideal for segmented and sample cutting of various types of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
It is compact and easy to operate. (Maximum workpiece size: 8 inches)

  • Target workpieces: Silicon, Quartz, Fluorite, Tungsten carbide

DW340S

Photo: DW340S

Single wire saw capable of cutting long workpieces

This fixed abrasive single wire saw is ideal for segmented and sample machining of a variety of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
An optional goniometer stage and Y-axis table for back and forth functions are available.
(Maximum workpiece size: 13 inches)

  • Target workpieces: Silicon, quartz, fluorite, tungsten carbide

Hard materials
(SiC, GaN, SiN, AlN, Neodymium magnet, Cemented carbides)

 

HW810

Photo: HW810

Highly-accurate, high-speed slicing of hard materials up to 8 inches with ultra-high wire speed

This diamond wire saw has the industry’s fastest wire speed of 3,000 m/min, which significantly reduces processing time, warpage, and wire usage. It also supports 8-inch down-cutting, contributing to lower CoO.

  • Target workpieces: SiC, GaN, Sintered materials

SW1730D

Photo: SW1730D

Wire saw that can perform high-tension machining of hard materials up to 6 inches with high linear speed

This diamond wire saw is capable of highly-accurate slicing with a narrow main roller pitch for workpieces up to 6 inches.
Highly-accurate high-speed slicing is possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, as well as high wire speeds and main roller oscillation.

  • Target workpieces: SiC, GaN, Sintered materials, Sapphire

SW2230D

Photo: SW2230D

Wire saw capable of high-tension slicing with high wire speed for hard materials up to 8 inches

Diamond wire saw capable of high-accuracy slicing with narrow center distance, supporting workpieces up to 8 inches.
Highly-accurate and high-speed slicing is made possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, high wire speeds, and main roller oscillation.

  • Target workpieces: SiC, GaN, Sintered materials, Sapphire

SW830D

Photo: SW830D

Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut

Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets

Compounds (GaAs, InP), Oxidized materials (LT/LN, GaO)

 

SW630D

Photo: SW630D

Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach

6 inch down-cut machine with the minimum wire slack made possible by using the industry's narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials

SW830D

Photo: SW830D

Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut

Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets

HW1215

Photo: HW1215

Highly-accurate high-speed machining with high workability and high wire speed

This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.

  • Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors

SW1215

Photo: SW1215

Compact wire saw with easy change-over, suitable for high-mix low-volume production

This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.

  • Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets

Semiconductors (Si, Ge)

 

SW630D

Photo: SW630D

Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach

6 inch down-cut machine with the minimum wire slack made possible by using the industry's narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials

SW830D

Photo: SW830D

Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut

Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets

Sintered materials (various ceramics),
Rare-earth materials (iridium, platinum)

 

HW1215

Photo: HW1215

Highly-accurate high-speed machining with high workability and high wire speed

This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.

  • Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors

SW1215

Photo: SW1215

Compact wire saw with easy change-over, suitable for high-mix low-volume production

This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.

  • Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets

SW630D

Photo: SW630D

Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach

6 inch down-cut machine with the minimum wire slack made possible by using the industry's narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials

Pipe materials, various other materials
(dicing, wide pitch cutting)

 

UD150

Photo: UD150

Compact wire saw capable of highly accurate dicing with high workability

This wire saw is super compact with high workabitlity, which makes it suitable for dicing and wide pitch slicing.
Designed to be compact but rigid, it allows for high wire speed and high tension for highly accurate slicing.

  • Target workpieces: Crystal, pipe materials, Rare-earth materials

HW1215

Photo: HW1215

Highly-accurate high-speed machining with high workability and high wire speed

This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.

  • Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors

SW1215

Photo: SW1215

Compact wire saw with easy change-over, suitable for high-mix low-volume production

This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.

  • Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets

Crystal, Quartz, Glass

 

SW3020

Photo: SW3020

Wire saw for highly-accurate slicing required in high precision crystal materials

This wire saw precisely cuts brittle materials.
Higher precision slicing is made possible by improved main roller and coolant temperature control.

  • Target workpieces: Crystal, LT/LN, Sintered materials

SW630D

Photo: SW630D

Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach

6 inch down-cut machine with the minimum wire slack made possible by using the industry's narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials

SW830D

Photo: SW830D

Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut

Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.

  • Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets

Various materials (cut by a single wire)

 

DW160S

Photo: DW160S

Easy-to-use compact single wire saw

This fixed abrasive single wire saw is ideal for segmented and sample cutting of various types of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
It is compact and easy to operate. (Maximum workpiece size: 8 inches)

  • Target workpieces: Silicon, Quartz, Fluorite, Tungsten carbide

DW340S

Photo: DW340S

Single wire saw capable of cutting long workpieces

This fixed abrasive single wire saw is ideal for segmented and sample machining of a variety of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
An optional goniometer stage and Y-axis table for back and forth functions are available.
(Maximum workpiece size: 13 inches)

  • Target workpieces: Silicon, quartz, fluorite, tungsten carbide

Dry cutting

 

SW1215 (dry Cutting)

Photo: SW1215

Dry cutting wire saw suitable for cutting materials that do not allow coolant use

This wire saw supports dry cutting using diamond wires.
Dry cutting, which does not use coolant, solves cutting problems that arise with materials that can be damaged by coolant and with materials being processed before sintering.
We can also propose flexible solutions for cutting chip issues.

  • Target workpieces: Mainly ceramics

DW160S

Photo: DW160S

Easy-to-use compact single wire saw

This fixed abrasive single wire saw is ideal for segmented and sample cutting of various types of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
It is compact and easy to operate. (Maximum workpiece size: 8 inches)

  • Target workpieces: Silicon, Quartz, Fluorite, Tungsten carbide

DW340S

Photo: DW340S

Single wire saw capable of cutting long workpieces

This fixed abrasive single wire saw is ideal for segmented and sample machining of a variety of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
An optional goniometer stage and Y-axis table for back and forth functions are available.
(Maximum workpiece size: 13 inches)

  • Target workpieces: Silicon, quartz, fluorite, tungsten carbide